- Multi layer rigid, flex, or rigid-flex boards
- From prototype, NPI to mass production
- Capable of mounting components as small as 1005 package.
- Micro BGA with 0.12 ball size. Capable of BGA rework / reballing.
- Placing accuracy up to 30 micron.
- Fast track prototyping to volume assembly.
- Automated in-line Optical Inspection.
- Manual Hand-Soldering
- 2D/3D X-Ray Inspection
State of art SMT lines to cater for high quality electronic products.